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Image Processing

algorithmically enhances image characterization.


Showing results: 151 - 165 of 237 items found.

  • Compact, Industrial Thermal Imaging Core

    Dione 320 OEM Series - Xenics

    The Dione 320 OEM is based on a state-of-the-art detector with a 320×240 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.All Dione 320 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 320 OEM series find application in industrial machine vision, medical, scientific and advanced research, safety and security systems.

  • Ultra Compact, Uncooled Thermal Imaging Core

    Dione 640 OEM Series - Xenics

    The Dione 640 OEM series is based on an uncooled 12 μm pitch microbolometer detector with a 640 × 480 resolution. The NETD is less than 40 mK (available upon request) or 50 mK. The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 25 x 25 x 10 mm3 and weight is 6 gr. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low. All Dione 640 versions have the same SAMTEC ST5 connector and are GenICam compliant.The ultra-compact Dione 640 OEM series find application in safety and security systems, as well as in industrial thermal imaging systems.

  • Compact, industrial thermal imaging core

    Dione 1024 OEM Series - Xenics

    The Dione 1024 OEM Series is based on a state-of-the-art detector with 1024×768 pixels and 12 μm pixel pitch. The NETD is less than 40 mK (available upon request) or 50 mK. The maximum frame rate is 80 Hz. It utilizes Xenics image enhancement for advanced image processing while keeping power consumption low.The cores are optimized for low SWaP (Size, Weight and Power). The overall size of the OEM core is 35x35x21.5 mm3 and the weight is 25 gr.All Dione 1024 versions have the same SAMTEC ST5 connector and are GenICam compliant.The compact Dione 1024 OEM series find application in safety & security, transportation and process monitoring.

  • Event Based Image Sensors

    EVS - Framos Technologies d.o.o.

    Event-based Vision Sensors (EVS) help alleviate this issue by only sending data from pixels who have detected a change in intensity. This allows them to minimize the volume of data that is transmitted over the sensor’s data bus while minimizing the processing resources need to analyze the image. On top of this, individual pixel autonomously responds to illuminance changes allowing the sensor to detect small and/or high frequency changes with lower bandwidth requirements.

  • FerruleMaster Ferrule Auto Test Instruments

    CA3003 - UC Instruments, Corp.

    FerruleMaster could feed, focus, measure and classify the ferrules automatically. It could test over 1000 PCS ferrules in one hour, no laborer required. Ferrule Master has the high performance and accuracy and high repeatablility with the superior image processing. It is intelligent and easy to operate and maintain. Clear user interface, easy to operate, stable performance and powerful analysis capability make the Ferrule Master is the best instrument in material inspection and mass production.

  • Spectroradiometer

    FieldSpec 4 Hi-Res NG - Analytical Spectral Devices, Inc.

    Higher resolution hyperspectral sensors yield greater precision for remote sensing classification applications, producing more information from every pixel generated in an image than ever before. To help maximize the full potential of these next generation sensors, measurements from ground based instrumentation need to meet or exceed the sensor’s spectral resolution. In the absence of this resolution equality, data is interpolated during post processing and vital spectral information can be smoothed and lost.

  • Embedded Motherboard supporting MXM Graphics Module with 8th/9th Generation Intel® Core™ i7/i5/i3 in LGA1151 Socket

    AMSTX-CF Series - ADLINK Technology Inc.

    Embedded graphics enables system developers to boost the performance of a wide range of workloads, including medical imaging, image analysis, compute acceleration, and artificial intelligence (AI). Leveraging graphics processing units (GPUs), embedded graphics can be used to increase application speed and accuracy, as well as decrease latency. Many embedded system developers are using embedded graphics solutions in real-world applications, such as medical, manufacturing, and traffic management, along with other embedded segments.

  • 3.4 MP Autofocus (Liquid Lens) Low Light Camera Module

    e-CAM31_MI0330_MOD - e-con Systems Inc.

    e-CAM31_MI0330_MOD is a high performance, small form factor, 3.4 MP Autofocus Low Light Camera Module with Liquid Lens. It is based on AR0330 CMOS Image sensor from ON Semiconductor®. This Autofocus Liquid Lens Camera Module has slave mode for precise frame-rate control and for synchronizing two sensors. e-CAM31_MI0330_MOD – Liquid lens camera module has superior low light performance. It supports Full HD @ 60fps for maximum video performance. It also has a support for external mechanical shutter and an on-chip phase-locked loop (PLL) oscillator. The dedicated ISP performs the entire Auto functions like auto white balance, auto exposure control in addition to complete image signal processing pipeline.

  • Intel® Celeron® N3160/ N3060 SoC Fanless Embedded Computer

    MXE-1500 Series - ADLINK Technology Inc.

    The successor to ADLINK's best-selling MXE-1300 Series, the MXE-1500 offers richer I/O interfaces, and more flexible I/O configurations in the same compact enclosure. Intel® Celeron®(Braswell) processors, Intel’s last generation of CPU to support Windows 7, power the MXE-1500 to a 90% increase in image processing capabilities over the previous generation, and support three independent displays, altogether delivering an unequaled price/performance ratio and making the MXE-1500 an ideal choice for industrial automation applications and mass transit operators.

  • VPX

    Data Patterns Pvt. Ltd.

    The VPX standard defined by ANSI/VITA 46.0 is a modern derivative of the older VME standards that is primarily targeted at defence applications, leveraging latest technologies in high speed electronics in order to provide higher performance computing, improved ruggedisation and thermal management capability, higher I/O densities and improved maintainability due to better immunity to ESD. Data Patterns has designed and manufactured a broad range of VPX products required for high end Radar / Electronic Warfare / Image Processing and Sonar applications.

  • Square Wave Patterns (Ronchi Gratings/Rulings)

    Applied Image, Inc.

    Square Wave patterns (Ronchi Gratings/Rulings) have extremely sharp edges. At APPLIED IMAGE, this sharpness is achieved through our unique manufacturing capabilities and processing technologies which produces the sharpest edges available anywhere. Our standard line of Ronchi Gratings is offered on Chrome on Glass (CG) and Photo Paper (RM).The Ronchi rulings are available on other substrate materials such as B270, quartz, BK-7, and White Opal as well as in English frequency metrics (cycles per inch).

  • SparkFun 2D Barcode Scanner Breakout

    SparkFun Electronics

    The SparkFun 2D Barcode Scanner Breakout is a nifty little breakout board featuring the DE2120 barcode scanner module from DYScan. The DE2120 reads 20 different barcode symbologies (both 1D and 2D) using a camera coupled with on-board image processing to identify and decode everything from UPC codes to QR codes. The module also features two LEDs: one for illumination and one to project the red line that you're used to seeing from laser-based scanners.

  • I-Pi SMARC Development Kit based on NXP® i.MX 8M Plus Quad Arm® Cortex-A53 Processor

    I-Pi SMARC IMX8M Plus - ADLINK Technology Inc.

    The I-Pi SMARC IMX8M Plus is a SMARC-based smart solution development kit powered by NXP i.MX8M Plus (Quad-core Arm Cortex-A53) processor with a Neural Processing Unit (NPU) at up to 2.3 TOPS.This is the first SMARC R2.1 development kit focused on machine learning, vision, advanced multimedia, and industrial IoT with high reliability. As such, it supports dual image processors and two camera inputs for an effective Vision System, as well as applications beyond, including smart homes, building cities, and industry 4.0.

  • SMARC Short Size Module with NXP i.MX 8M Plus

    LEC-IMX8MP - ADLINK Technology Inc.

    ADLINK LEC-IMX8MP, based on the powerful NXP i.MX8M Plus (quad core Arm Cortex-A53) processor with an optional Neural Processing Unit (NPU) operating at up to 2.3 TOPS., is the first SMARC revision 2.1 compliant module focusing on machine learning and vision, advanced multimedia, and industrial IoT with high reliability. Additionally, it supports dual Image Signal Processors and two camera inputs for an effective Vision System. The LEC-IMX8MP is suited for applications such as smart home, building, city and industry 4.0.

  • High Definition Mid-Range Surveillance System

    Ranger® HDC MR - Teledyne FLIR

    The Ranger HDC MR sets a new standard for surveillance with its ability to detect illegal activities even in degraded weather conditions, utilizing embedded analytics and image processing to reduce the cognitive workload, enabling operators to distinguish quickly between true threats and false alarms. The HDC MR is not only a superior system in bad weather, it also provides increased uptime and reduces cyber risks -- a reliable tool that adds days of efficient surveillance and reduces risk compared to previous generations of systems.

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